On the occasion of the VLSI Symposiumorganized every year by the IEEE (Institute of Electrical and Electronics Engineers), Intel has released new information pertaining to its upcoming lithographic nodes, including Intel 4 (formerly known as 7nm), who will be the first to employ the technique EUV (Extreme Ultra Violet). Currently, the Santa Clara company is extensively using its renamed 10nm node Intel 7and, with respect to this, Intel 4 will be able to offer the 20% more performance and a doubling of the logic density. In practice, as expected, Intel 7 will guarantee higher performance, greater energy efficiency and higher density.
Photo Credit: Intel Photo Credit: Intel
The new node will be used for the first time with Meteor LakeMulti-chip CPU that will also make use of advanced packaging technologies. In fact, according to the latest rumors, Meteor Lake processors should consist of three tiles: a compute die with an unknown number of high-performance and energy-efficient cores, a GPU die with 96-192 EU and a SoC die with drives such as a memory controller, a PCIe controller, and a Thunderbolt controller. Furthermore, these CPUs will be extremely scalable in terms of power (from 5 to 125 W), so as to adapt them to a wide range of devices.
EUV technology is particularly important, as it allows you to reduce the number of masks and multi-patterns: Intel talked about a 20% decrease compared to Intel 7. However, it should be noted that doubling the density of transistors only applies to logic, while other structures, such as SRAM, they can count on a smaller increase in density. Recall that the fourteenth generation Intel Core processors (Meteor Lake) will debut on the market only next year.